Please use this identifier to cite or link to this item: http://repository.ipb.ac.id/handle/123456789/73981
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dc.contributor.advisorSuryana, Jajang
dc.contributor.authorMaharani, Gisella Indira
dc.date.accessioned2015-02-12T02:14:25Z
dc.date.available2015-02-12T02:14:25Z
dc.date.issued2014
dc.identifier.urihttp://repository.ipb.ac.id/handle/123456789/73981
dc.description.abstractPlywood is a product that is obtained by arranging the perpendicular cross veneer glued with adhesive. The aim of this study was to test and analyze the characteristics of plywood bonded by epoxy extreme demp-x adhesive and compare it with the SNI 01-5008.7-1999 and 01-5008.2-2000 standards. 8%, 40%, 50%, and 60% water content and the glue spread of 200 and 225 g/m2 were used in this research. Characteristics of plywood tested by measuring physical properties included moisture content, density, dimensional stability, and delamination. The testing of mechanical properties included Modulus of Elasticity (MOE), Modulus of Rupture (MOR), and the bonding strength. Delamination of plywood met the SNI 01-5008.2-2000 standard while the bonding strength and MOR perpendicular fibers met SNI 01-5008.7-1999 standard.en
dc.language.isoid
dc.subject.ddcForest Producten
dc.titleKarakteristik Kayu Lapis yang Direkat dengan Perekat Epoxy Extreme Demp-xen
dc.subject.keywordBogor Agricultural University (IPB)en
dc.subject.keywordplywooden
dc.subject.keywordphysical propertiesen
dc.subject.keywordmechanical propertiesen
dc.subject.keywordepoxy extreme demp-xen
Appears in Collections:UT - Forestry Products

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